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ntc thermistors for temperature measurement glass-encapsulated sensors with insulation series/type: b57551g1 date: january 2016 ? epcos ag 2015. reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without epcos' prior express consent is prohibited. epcos ag is a tdk group company.
applications temperature measurement features glass-encapsulated ntc thermistor, heat-resistant and highly stable coating of glass body and leads for electrical insulation for temperature measurement up to 260 c short response time small dimensions leads: dumet wires (copper-clad feni) options alternative dimensions available on request delivery mode bulk dimensional drawing dimensions in mm approx. weight 60 mg general technical data climatic category (iec 60068-1) 55/260/56 max. power (at 25 c) p 25 32 mw resistance tolerance d r r /r r 1, 2, 3 % rated temperature t r 25 c dissipation factor (in air) d th approx. 0.8 mw/k thermal cooling time constant (in air) t c approx. 9 s heat capacity c th approx. 7.2 mj/k insulation resistance 1) (v = 100 v dc) r ins 3 100 m w test voltage 1) (t = 1 s) v test 500 v dc 1) medium: nacl-solution; temperature: room temperature temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 2 of 24 please read cautions and warnings and important notes at the end of this document.
electrical specification and ordering codes r 25 w no. of r/t characteristic b 25/85 k b 0/100 k b 25/100 k ordering code + = resistance tolerance f = 1% g = 2% h = 3% 2 k 8320 3406 3379 3420 1% b57551g1202+000 2.5 k 7006 3546 3517 3560 1% b57551g1252+000 5 k 8326 3483 3456 3497 1% b57551g1502+000 10 k 8307 3478 3450 3492 1% b57551g1103+000 10 k 7003 3612 3586 3625 1% b57551g1103+005 20 k 8332 3993 3965 4006 1% b57551g1203+000 30 k 8344 3992 3965 4006 1% b57551g1303+000 50 k 8344 3992 3965 4006 1% b57551g1503+000 100 k 8304 4072 4036 4092 1% b57551g1104+000 230 k 8350 4240 4198 4264 1% b57551g1234+000 reliability data test standard test conditions d r 25 /r 25 (typical) remarks storage in dry heat iec 60068-2-2 storage at upper category temperature t: 260 c t: 1000 h < 3% no visible damage storage in damp heat, steady state iec 60068-2-67 temperature of air: 85 c relative humidity of air: 85% duration: 1000 h < 2% no visible damage rapid temperature cycling iec 60068-2-14 lower test temperature: 55 c upper test temperature: 200 c number of cycles: 1000 < 2% no visible damage temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 3 of 24 please read cautions and warnings and important notes at the end of this document.
reliability data according to aec-q200, rev. d test standard test conditions d r 25 /r 25 (typical) remarks high temperature exposure (storage) mil-std-202, method 108 storage at t = +125 c t = 1000 h < 2% no visible damage operational life mil-std-202, method 108 1000 h / +125 c test voltage max. 0.3 v dc on ntc 1) < 2% no visible damage temperature cycling jesd 22, method ja-104 lower test temperature: 55 c upper test temperature: 125 c 1000 cycles dwell time: max. 30 min at each temperature transition time in air: max. 1 min < 2% no visible damage terminal strength (leaded) mil-std-202, method 211 test leaded device integrity condition a: 2.27 n 2) < 1% no visible damage mechanical shock mil-std-202, method 213, condition c acceleration: 40 g 2) pulse duration: 6 ms number of bumps: 3, each direction < 1% no visible damage vibration mil-std-202, method 204 acceleration: 5 g t = 20 min 12 cycles in each of 3 directions frequency range: 10 to 2000 hz < 1% no visible damage 1) self heating of the ntc thermistor must not exceed 0.2 k, steady state. test conditions deviating from aec q200, rev. d. 2) deviating from aec q200, rev. d. note contact of ntc thermistors with any liquids and solvents shall be prevented. it must be ensured that no water enters the ntc thermistors (e.g. through plug terminals). avoid dewing and condensation unless thermistor is specified for these conditions. temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 4 of 24 please read cautions and warnings and important notes at the end of this document.
r/t characteristics r/t no. 7003 7006 8304 t ( c) b 25/100 = 3625 k b 25/100 = 3560 k b 25/100 = 4092 k r t /r 25 a (%/k) r t /r 25 a (%/k) r t /r 25 a (%/k) 55.0 63.225 6.7 55.947 6.4 100.11 7.4 50.0 45.46 6.5 40.765 6.2 69.56 7.2 45.0 33.07 6.3 30.014 6.0 48.945 6.9 40.0 24.324 6.0 22.321 5.8 34.853 6.7 35.0 18.081 5.8 16.760 5.6 25.102 6.5 30.0 13.575 5.6 12.700 5.5 18.275 6.2 25.0 10.29 5.4 9.7089 5.3 13.443 6.0 20.0 7.8716 5.3 7.4853 5.1 9.9853 5.9 15.0 6.0739 5.1 5.8179 5.0 7.4867 5.7 10.0 4.7258 4.9 4.5572 4.8 5.6636 5.5 5.0 3.7062 4.8 3.5965 4.7 4.3212 5.3 0.0 2.9287 4.6 2.8586 4.5 3.324 5.2 5.0 2.3311 4.5 2.2878 4.4 2.5769 5.0 10.0 1.8684 4.4 1.8431 4.3 2.0127 4.9 15.0 1.5075 4.2 1.4943 4.1 1.5834 4.7 20.0 1.224 4.1 1.2188 4.0 1.2542 4.6 25.0 1.0000 4.0 1.0000 3.9 1.0000 4.5 30.0 0.82176 3.9 0.82508 3.8 0.80239 4.3 35.0 0.67909 3.8 0.68444 3.7 0.64776 4.2 40.0 0.56422 3.7 0.57073 3.6 0.52598 4.1 45.0 0.47122 3.6 0.47829 3.5 0.4295 4.0 50.0 0.3955 3.5 0.40276 3.4 0.35262 3.9 55.0 0.33355 3.4 0.34072 3.3 0.291 3.8 60.0 0.2826 3.3 0.28953 3.2 0.24136 3.7 65.0 0.24049 3.2 0.24709 3.1 0.20114 3.6 70.0 0.20553 3.1 0.21174 3.0 0.16841 3.5 75.0 0.17637 3.0 0.18217 3.0 0.14164 3.4 80.0 0.15195 2.9 0.15734 2.9 0.11963 3.3 85.0 0.13141 2.9 0.13639 2.8 0.10147 3.3 90.0 0.11406 2.8 0.11866 2.8 0.086407 3.2 95.0 0.099352 2.7 0.10358 2.7 0.073867 3.1 100.0 0.086837 2.7 0.090727 2.6 0.063383 3.0 105.0 0.076149 2.6 0.079722 2.6 0.054584 3.0 110.0 0.066989 2.5 0.070269 2.5 0.04717 2.9 115.0 0.059112 2.5 0.062124 2.4 0.040901 2.8 120.0 0.052316 2.4 0.055081 2.4 0.035581 2.8 125.0 0.046433 2.4 0.048974 2.3 0.03105 2.7 130.0 0.041327 2.3 0.043662 2.3 0.027179 2.6 135.0 0.03688 2.3 0.039029 2.2 0.023861 2.6 140.0 0.032998 2.2 0.034975 2.2 0.021008 2.5 145.0 0.029598 2.2 0.031420 2.1 0.018548 2.5 150.0 0.026612 2.1 0.028293 2.1 0.016419 2.4 155.0 0.023984 2.1 0.025536 2.0 0.014573 2.4 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 5 of 24 please read cautions and warnings and important notes at the end of this document.
r/t no. 7003 7006 8304 t ( c) b 25/100 = 3625 k b 25/100 = 3560 k b 25/100 = 4092 k r t /r 25 a (%/k) r t /r 25 a (%/k) r t /r 25 a (%/k) 160.0 0.021665 2.0 0.023099 2.0 0.012967 2.3 165.0 0.019613 2.0 0.020939 1.9 0.011566 2.3 170.0 0.017793 1.9 0.019022 1.9 0.010341 2.2 175.0 0.016176 1.9 0.017315 1.9 0.0092664 2.2 180.0 0.014735 1.8 0.015774 1.8 0.0083224 2.1 185.0 0.013448 1.8 0.014407 1.8 0.0074907 2.1 190.0 0.012297 1.8 0.013189 1.7 0.0067564 2.0 195.0 0.011265 1.7 0.012099 1.7 0.0061064 2.0 200.0 0.010338 1.7 0.011120 1.7 0.0055299 2.0 205.0 0.009504 1.7 0.010236 1.6 0.0050175 1.9 210.0 0.0087516 1.6 0.0094369 1.6 0.0045611 1.9 215.0 0.0080718 1.6 0.0087121 1.6 0.0041537 1.9 220.0 0.0074567 1.6 0.0080536 1.6 0.0037895 1.8 225.0 0.0068989 1.5 0.0074542 1.5 0.0034631 1.8 230.0 0.0063925 1.5 0.0069079 1.5 0.0031701 1.8 235.0 0.0059318 1.5 0.0064094 1.5 0.0029067 1.7 240.0 0.005512 1.5 0.0059539 1.5 0.0026693 1.7 245.0 0.005129 1.4 0.0055376 1.4 0.0024551 1.7 250.0 0.004779 1.4 0.0051566 1.4 0.0022615 1.6 255.0 0.0044586 1.4 0.0048079 1.4 0.0020862 1.6 260.0 0.004165 1.4 0.0044885 1.4 0.0019273 1.6 265.0 0.0038955 1.3 0.0041957 1.3 0.0017829 1.5 270.0 0.0036478 1.3 0.0039274 1.3 0.0016516 1.5 275.0 0.0034199 1.3 0.0036812 1.3 0.0015319 1.5 280.0 0.0032098 1.3 0.0034554 1.3 0.0014228 1.5 285.0 0.003016 1.2 0.0032481 1.2 0.0013231 1.4 290.0 0.002837 1.2 0.0030579 1.2 0.0012319 1.4 295.0 0.0026714 1.2 0.0028831 1.2 0.0011483 1.4 300.0 0.002518 1.2 0.0027226 1.1 0.0010716 1.4 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 6 of 24 please read cautions and warnings and important notes at the end of this document.
r/t characteristics r/t no. 8307 8320 8326 t ( c) b 25/100 = 3492 k b 25/100 = 3420 k b 25/100 = 3497 k r t /r 25 a (%/k) r t /r 25 a (%/k) r t /r 25 a (%/k) 55.0 52.624 6.4 48.459 6.2 53.680 6.4 50.0 38.452 6.2 35.668 6 39.112 6.2 45.0 28.401 6.0 26.524 5.8 28.817 6.0 40.0 21.194 5.8 19.920 5.6 21.459 5.8 35.0 15.972 5.6 15.103 5.4 16.142 5.6 30.0 12.149 5.4 11.554 5.3 12.259 5.4 25.0 9.3246 5.2 8.9165 5.1 9.3959 5.2 20.0 7.2181 5.0 6.9383 4.9 7.2644 5.1 15.0 5.6332 4.9 5.4421 4.8 5.6633 4.9 10.0 4.4308 4.7 4.3012 4.6 4.4503 4.7 5.0 3.5112 4.6 3.4243 4.5 3.5236 4.6 0.0 2.8024 4.4 2.7454 4.4 2.8102 4.5 5.0 2.252 4.3 2.2158 4.2 2.2567 4.3 10.0 1.8216 4.2 1.7999 4.1 1.8243 4.2 15.0 1.4827 4.1 1.4711 4 1.4841 4.1 20.0 1.2142 3.9 1.2095 3.9 1.2147 3.9 25.0 1.0000 3.8 1.0000 3.7 1.0000 3.8 30.0 0.82818 3.7 0.83132 3.6 0.82785 3.7 35.0 0.68954 3.6 0.69471 3.5 0.68900 3.6 40.0 0.57703 3.5 0.58346 3.4 0.57639 3.5 45.0 0.48525 3.4 0.49239 3.3 0.48457 3.4 50.0 0.41 3.3 0.41746 3.3 0.40931 3.3 55.0 0.34798 3.2 0.35551 3.2 0.34731 3.2 60.0 0.29663 3.2 0.30405 3.1 0.29599 3.2 65.0 0.25392 3.1 0.26111 3 0.25332 3.1 70.0 0.21824 3.0 0.22512 2.9 0.21768 3.0 75.0 0.1883 2.9 0.19484 2.9 0.18779 2.9 80.0 0.16307 2.8 0.16925 2.8 0.16261 2.8 85.0 0.14174 2.8 0.14754 2.7 0.14131 2.8 90.0 0.12362 2.7 0.12905 2.6 0.12324 2.7 95.0 0.10818 2.6 0.11325 2.6 0.10783 2.6 100.0 0.094973 2.6 0.099707 2.5 0.094663 2.6 105.0 0.08364 2.5 0.088049 2.5 0.083361 2.5 110.0 0.073881 2.5 0.077984 2.4 0.073638 2.5 115.0 0.06545 2.4 0.069267 2.3 0.065240 2.4 120.0 0.058144 2.3 0.061694 2.3 0.057964 2.3 125.0 0.051794 2.3 0.055095 2.2 0.051640 2.3 130.0 0.046259 2.2 0.049329 2.2 0.046128 2.2 135.0 0.04142 2.2 0.044277 2.1 0.041309 2.2 140.0 0.037179 2.1 0.039838 2.1 0.037085 2.1 145.0 0.033451 2.1 0.035927 2 0.033373 2.1 150.0 0.030166 2.0 0.032474 2 0.030102 2.0 155.0 0.027264 2.0 0.029417 2 0.027213 2.0 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 7 of 24 please read cautions and warnings and important notes at the end of this document.
r/t no. 8307 8320 8326 t ( c) b 25/100 = 3492 k b 25/100 = 3420 k b 25/100 = 3497 k r t /r 25 a (%/k) r t /r 25 a (%/k) r t /r 25 a (%/k) 160.0 0.024694 2.0 0.026703 1.9 0.024654 2.0 165.0 0.022414 1.9 0.024290 1.9 0.022384 1.9 170.0 0.020385 1.9 0.022139 1.8 0.020364 1.9 175.0 0.018577 1.8 0.020217 1.8 0.018564 1.8 180.0 0.016961 1.8 0.018497 1.8 0.016955 1.8 185.0 0.015514 1.8 0.016953 1.7 0.015515 1.8 190.0 0.014216 1.7 0.015566 1.7 0.014223 1.7 195.0 0.013049 1.7 0.014317 1.7 0.013063 1.7 200.0 0.011999 1.7 0.013189 1.6 0.012017 1.7 205.0 0.011051 1.6 0.012159 1.6 0.011074 1.6 210.0 0.010194 1.6 0.011231 1.6 0.010222 1.6 215.0 0.0094181 1.6 0.010391 1.5 0.0094500 1.6 220.0 0.0087144 1.5 0.0096285 1.5 0.0087502 1.5 225.0 0.0080751 1.5 0.0089347 1.5 0.0081144 1.5 230.0 0.0074933 1.5 0.0083021 1.5 0.0075359 1.5 235.0 0.0069631 1.5 0.0077243 1.4 0.0070087 1.4 240.0 0.0064791 1.4 0.0071956 1.4 0.0065276 1.4 245.0 0.0060366 1.4 0.0067110 1.4 0.0060877 1.4 250.0 0.0056316 1.4 0.0062662 1.4 0.0056850 1.4 255.0 0.0052602 1.4 0.0058573 1.3 0.0053159 1.3 260.0 0.0049193 1.3 0.0054811 1.3 0.0049770 1.3 265.0 0.0046059 1.3 0.0051346 1.3 0.0046654 1.3 270.0 0.0043173 1.3 0.0048149 1.3 0.0043786 1.3 275.0 0.0040514 1.3 0.0045199 1.3 0.0041143 1.2 280.0 0.003806 1.2 0.0042472 1.2 0.0038703 1.2 285.0 0.0035793 1.2 0.0039950 1.2 0.0036449 1.2 290.0 0.0033696 1.2 0.0037616 1.2 0.0034363 1.2 295.0 0.0031753 1.2 0.0035453 1.2 0.0032431 1.1 300.0 0.0029952 1.2 0.0033448 1.2 0.0030640 1.1 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 8 of 24 please read cautions and warnings and important notes at the end of this document.
r/t characteristics r/t no. 8332 8344 8350 t ( c) b 25/100 = 4006 k b 25/100 = 4006 k b 25/100 = 4264 k r t /r 25 a (%/k) r t /r 25 a (%/k) r t /r 25 a (%/k) 55.0 97.675 7.4 99.651 7.5 113.81 7.5 50.0 67.930 7.1 69.067 7.2 78.679 7.3 45.0 47.838 6.9 48.490 6.9 55.027 7 40.0 34.093 6.7 34.465 6.7 38.917 6.8 35.0 24.576 6.4 24.786 6.5 27.821 6.6 30.0 17.909 6.2 18.026 6.3 20.096 6.4 25.0 13.186 6 13.251 6.1 14.661 6.2 20.0 9.8062 5.8 9.8411 5.9 10.798 6 15.0 7.3621 5.6 7.3803 5.7 8.0269 5.8 10.0 5.5776 5.5 5.5866 5.5 6.0195 5.7 5.0 4.2625 5.3 4.2667 5.3 4.5526 5.5 0.0 3.2848 5.1 3.2865 5.1 3.4713 5.3 5.0 2.5517 5 2.5522 5 2.6676 5.2 10.0 1.9974 4.8 1.9974 4.8 2.0654 5 15.0 1.5750 4.7 1.5749 4.7 1.6108 4.9 20.0 1.2508 4.5 1.2507 4.5 1.2649 4.8 25.0 1.0000 4.4 1.0000 4.4 1.0000 4.6 30.0 0.80472 4.3 0.80481 4.3 0.79564 4.5 35.0 0.65163 4.2 0.65179 4.2 0.63697 4.4 40.0 0.53084 4 0.53105 4 0.51297 4.3 45.0 0.43494 3.9 0.43517 3.9 0.41548 4.2 50.0 0.35834 3.8 0.35858 3.8 0.33837 4.1 55.0 0.29681 3.7 0.29705 3.7 0.27704 3.9 60.0 0.24711 3.6 0.24733 3.6 0.22798 3.8 65.0 0.20676 3.5 0.20695 3.5 0.18854 3.8 70.0 0.17381 3.4 0.17398 3.4 0.15666 3.7 75.0 0.14679 3.3 0.14693 3.3 0.13077 3.6 80.0 0.12451 3.2 0.12462 3.3 0.10964 3.5 85.0 0.10607 3.2 0.10615 3.2 0.092312 3.4 90.0 0.090731 3.1 0.090781 3.1 0.078045 3.3 95.0 0.077916 3 0.077940 3 0.066245 3.2 100.0 0.067168 2.9 0.067168 2.9 0.056445 3.2 105.0 0.058116 2.9 0.058094 2.9 0.048274 3.1 110.0 0.050462 2.8 0.050422 2.8 0.041434 3 115.0 0.043967 2.7 0.043911 2.7 0.035686 3 120.0 0.038435 2.7 0.038365 2.7 0.030839 2.9 125.0 0.033707 2.6 0.033625 2.6 0.026737 2.8 130.0 0.029651 2.5 0.029589 2.5 0.023253 2.8 135.0 0.026162 2.5 0.026110 2.5 0.020285 2.7 140.0 0.023151 2.4 0.023099 2.4 0.017747 2.6 145.0 0.020543 2.4 0.020487 2.4 0.015571 2.6 150.0 0.018279 2.3 0.018215 2.3 0.013700 2.5 155.0 0.016307 2.3 0.016235 2.3 0.012086 2.5 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 9 of 24 please read cautions and warnings and important notes at the end of this document.
r/t no. 8332 8344 8350 t ( c) b 25/100 = 4006 k b 25/100 = 4006 k b 25/100 = 4264 k r t /r 25 a (%/k) r t /r 25 a (%/k) r t /r 25 a (%/k) 160.0 0.014585 2.2 0.014504 2.2 0.010690 2.4 165.0 0.013077 2.2 0.012989 2.2 0.0094790 2.4 170.0 0.011753 2.1 0.011659 2.1 0.0084257 2.3 175.0 0.010588 2.1 0.010488 2.1 0.0075072 2.3 180.0 0.0095600 2 0.0094560 2 0.0067043 2.2 185.0 0.0086500 2 0.0085436 2 0.0060006 2.2 190.0 0.0078436 1.9 0.0077352 2 0.0053824 2.2 195.0 0.0071269 1.9 0.0070175 1.9 0.0048381 2.1 200.0 0.0064887 1.9 0.0063789 1.9 0.0043578 2.1 205.0 0.0059191 1.8 0.0058096 1.9 0.0039330 2 210.0 0.0054097 1.8 0.0053008 1.8 0.0035564 2 215.0 0.0049532 1.7 0.0048453 1.8 0.0032220 2 220.0 0.0045432 1.7 0.0044367 1.7 0.0029244 1.9 225.0 0.0041744 1.7 0.0040694 1.7 0.0026590 1.9 230.0 0.0038420 1.6 0.0037386 1.7 0.0024219 1.9 235.0 0.0035419 1.6 0.0034402 1.6 0.0022096 1.8 240.0 0.0032704 1.6 0.0031706 1.6 0.0020193 1.8 245.0 0.0030243 1.5 0.0029264 1.6 0.0018483 1.8 250.0 0.0028010 1.5 0.0027049 1.6 0.0016944 1.7 255.0 0.0025980 1.5 0.0025038 1.5 0.0015557 1.7 260.0 0.0024131 1.5 0.0023207 1.5 0.0014305 1.7 265.0 0.0022445 1.4 0.0021539 1.5 0.0013173 1.6 270.0 0.0020905 1.4 0.0020016 1.5 0.0012147 1.6 275.0 0.0019496 1.4 0.0018624 1.4 0.0011216 1.6 280.0 0.0018205 1.4 0.0017350 1.4 0.0010371 1.6 285.0 0.0017021 1.3 0.0016182 1.4 0.00096018 1.5 290.0 0.0015934 1.3 0.0015109 1.4 0.00089010 1.5 295.0 0.0014933 1.3 0.0014124 1.3 0.00082616 1.5 300.0 0.0014012 1.3 0.0013216 1.3 0.00076774 1.5 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 10 of 24 please read cautions and warnings and important notes at the end of this document.
mounting instructions 1 soldering 1.1 leaded ntc thermistors leaded thermistors comply with the solderability requirements specified by cecc. when soldering, care must be taken that the ntc thermistors are not damaged by excessive heat. the following maximum temperatures, maximum time spans and minimum distances have to be observed: dip soldering iron soldering bath temperature max. 260 c max. 360 c soldering time max. 4 s max. 2 s distance from thermistor min. 6 mm min. 6 mm under more severe soldering conditions the resistance may change. 1.2 leadless ntc thermistors in case of ntc thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. the temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. to prevent leaching of the metallization, solder with silver additives or with a low tin content should be used. in addition, soldering methods should be employed which permit short soldering times. 1.3 smd ntc thermistors smd ntc thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. the usage of mild, non-activated fluxes for soldering is recommend- ed as well as a proper cleaning of the pcb. nickel barrier termination the nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the silver base metalization layer. this allows great flexibility in the selection of soldering parameters. the tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. the nickel barrier termination is suitable for all commonly-used soldering methods. note: smd ntcs with agpd termination are not approved for lead-free soldering. figure 1 smd ntc thermistors, structure of nickel barrier termination temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 11 of 24 please read cautions and warnings and important notes at the end of this document.
1.3.1 solderability (test to iec 60068-2-58) preconditioning: immersion into flux f-sw 32. evaluation criterion: wetting of soldering areas 3 95%. solder bath temperature ( c) dwell time (s) snpb 60/40 215 3 3 0.3 snag (3.0 ... 4.0), cu (0.5 ... 0.9) 245 3 3 0.3 1.3.2 resistance to soldering heat (test to iec 60068-2-58) preconditioning: immersion into flux f-sw 32. evaluation criterion: leaching of side edges 1/3. solder bath temperature ( c) dwell time (s) snpb 60/40 260 5 10 1 snag (3.0 ... 4.0), cu (0.5 ... 0.9) 260 5 10 1 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 12 of 24 please read cautions and warnings and important notes at the end of this document.
wave soldering temperature characteristic at component terminal with dual wave soldering solder joint profiles for silver/nickel/tin terminations temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 13 of 24 please read cautions and warnings and important notes at the end of this document.
reflow soldering recommended temperature characteristic for reflow soldering following jedec j-std-020d profile feature sn-pb eutectic assembly pb-free assembly preheat and soak - temperature min t smin 100 c 150 c - temperature max t smax 150 c 200 c - time t smin to t smax 60 ... 120 s 60 ... 180 s average ramp-up rate t smax to t p 3 c/ s max. 3 c/ s max. liquidous temperature t l 183 c 217 c time at liquidous t l 60 ... 150 s 60 ... 150 s peak package body temperature t p 1) 220 c ... 235 c 2) 245 c ... 260 c 2) time (t p ) 3) within 5 c of specified classification temperature (t c ) 20 s 3) 30 s 3) average ramp-down rate t p to t smax 6 c/ s max. 6 c/ s max. time 25 c to peak temperature max. 6 minutes max. 8 minutes 1) tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. 2) depending on package thickness. for details please refer to jedec j-std-020d. 3) tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. note: all temperatures refer to topside of the package, measured on the package body surface. number of reflow cycles: 3 temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 14 of 24 please read cautions and warnings and important notes at the end of this document.
solder joint profiles for silver/nickel/tin terminations 1.3.3 recommended geometry of solder pads recommended maximum dimensions (mm) case size inch/mm a b c 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.3.4 notes iron soldering should be avoided, hot air methods are recommended for repair purposes. temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 15 of 24 please read cautions and warnings and important notes at the end of this document.
2 conductive adhesion an alternative to soldering is the gluing of thermistors with conductive adhesives. the benefit of this method is that it involves no thermal stress. the adhesives used must be chemically inert. 3 clamp contacting pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers. 4 robustness of terminations (leaded types) the leads meet the requirements of iec 60068-2-21. they may not be bent closer than 4 mm from the solder joint on the thermistor body or from the point at which they leave the feed- throughs. during bending, any mechanical stress at the outlet of the leads must be removed. the bending radius should be at least 0.75 mm. tensile strength: test ua1: leads ? 0.25 mm = 1.0 n 0.25 < ? 0.35 mm = 2.5 n 0.35 < ? 0.50 mm = 5.0 n 0.50 < ? 0.80 mm = 10.0 n 0.80 < ? 1.25 mm = 20.0 n bending strength: test ub: two 90 -bends in opposite directions at a weight of 0.25 kg. torsional strength: test uc: severity 2 the lead is bent by 90 at a distance of 6 to 6.5 mm from the thermistor body. the bending radius of the leads should be approx. 0.75 mm. two torsions of 180 each (severity 2). when subjecting leads to mechanical stress, the following should be observed: tensile stress on leads during mounting and operation tensile forces on the leads are to be avoided. bending of leads bending of the leads directly on the thermistor body is not permissible. a lead may be bent at a minimum distance of twice the wire's diameter +2 mm from the solder joint on the thermistor body. during bending the wire must be mechanically relieved at its outlet. the bending radius should be at least 0.75 mm. temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 16 of 24 please read cautions and warnings and important notes at the end of this document.
5 sealing and potting when thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. the upper category temperature of the thermistor must not be exceeded. ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. 6 cleaning washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). they may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. 7 storage in order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere. humidity, temperature and container materials are critical factors. do not store smds where they are exposed to heat or direct sunlight. otherwise, the packing ma- terial may be deformed or smds may stick together, causing problems during mounting. after opening the factory seals, such as polyvinyl-sealed packages, use the smds as soon as possible. the components should be left in the original packing. touching the metallization of unsoldered thermistors may change their soldering properties. storage temperature: 25 c up to 45 c relative humidity (without condensation): 75% annual mean <95%, maximum 30 days per annum solder the thermistors listed in this data book after shipment from epcos within the time speci- fied: smds with nickel barrier termination: 12 months smds with agpd termination: 6 months leaded components: 24 months temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 17 of 24 please read cautions and warnings and important notes at the end of this document.
8 placement and orientation of smd ntc thermistors on pcb a) component placement it is recommended that the pc board should be held by means of some adequate supporting pins such as shown left to prevent the smds from being damaged or cracked. b) cracks when placing a component near an area which is apt to bend or a grid groove on the pc board, it is advisable to have both electrodes subjected to uniform stress, or to position the component's electrodes at right angles to the grid groove or bending line (see c) component orientation). c) component orientation choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 18 of 24 please read cautions and warnings and important notes at the end of this document.
cautions and warnings see "important notes". storage store thermistors only in original packaging. do not open the package prior to processing. storage conditions in original packaging: storage temperature 25 c ... +45 c, relative humidity 75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. do not store thermistors where they are exposed to heat or direct sunlight. otherwise, the packing material may be deformed or components may stick together, causing problems during mounting. avoid contamination of thermistor surface during storage, handling and processing. avoid storage of thermistors in harmful environments like corrosive gases (so x , cl etc). use the components as soon as possible after opening the factory seals, i.e. the polyvinyl-sealed packages. solder thermistors within the time specified after shipment from epcos. for leaded components this is 24 months, for smd components with nickel barrier termination 12 months, for smd components with agpd termination 6 months. handling ntc thermistors must not be dropped. chip-offs or any other damage must not be caused during handling of ntcs. do not touch components with bare hands. gloves are recommended. avoid contamination of thermistor surface during handling. washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). they may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. bending / twisting leads a lead (wire) may be bent at a minimum distance of twice the wire?s diameter plus 4 mm from the component head or housing. when bending ensure the wire is mechanically relieved at the component head or housing. the bending radius should be at least 0.75 mm. soldering use resin-type flux or non-activated flux. insufficient preheating may cause ceramic cracks. rapid cooling by dipping in solvent is not recommended. complete removal of flux is recommended. temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 19 of 24 please read cautions and warnings and important notes at the end of this document.
mounting ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. the maximum temperature of the thermistor must not be exceeded. ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral. electrodes/contacts must not be scratched or damaged before/during/after the mounting process. contacts and housing used for assembly with the thermistor must be clean before mounting. ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. be sure that surrounding parts and materials can withstand the temperature. avoid contamination of the thermistor surface during processing. the connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to an environment with normal atmospheric conditions. tensile forces on cables or leads must be avoided during mounting and operation. bending or twisting of cables or leads directly on the thermistor body is not permissible. avoid using chemical substances as mounting aids. it must be ensured that no water or other liquids enter the ntc thermistors (e.g. through plug terminals). in particular, water based substances (e.g. soap suds) must not be used as mounting aids for sensors. operation use thermistors only within the specified operating temperature range. use thermistors only within the specified power range. environmental conditions must not harm the thermistors. only use the thermistors under normal atmospheric conditions or within the specified conditions. contact of ntc thermistors with any liquids and solvents shall be prevented. it must be ensured that no water enters the ntc thermistors (e.g. through plug terminals). for measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as galden). avoid dewing and condensation unless thermistor is specified for these conditions. bending or twisting of cables and/or wires is not permissible during operation of the sensor in the application. be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction. this listing does not claim to be complete, but merely reflects the experience of epcos ag. display of ordering codes for epcos products the ordering code for one and the same epcos product can be represented differently in data sheets, data books, other publications, on the epcos website, or in order-related documents such as shipping notes, order confirmations and product labels. the varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products . detailed information can be found on the internet under www.epcos.com/orderingcodes temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 20 of 24 please read cautions and warnings and important notes at the end of this document.
symbols and terms symbol english german a area fl?che awg american wire gauge amerikanische norm fr drahtquerschnitte b b value b-wert b 25/100 b value determined by resistance measurement at 25 c and 100 c b-wert, ermittelt durch widerstands- messungen bei 25 c und 100 c c th heat capacitance w?rmekapazit?t i current strom n number (integer) anzahl (ganzzahliger wert) p 25 maximum power at 25 c maximale leistung bei 25 c p diss power dissipation verlustleistung p el electrical power elektrische leistung p max maximum power within stated temperature range maximale leistung im angegebenentemperaturbereich d r b /r b resistance tolerance caused by spread of b value widerstandstoleranz, die durch die streuung des b-wertes verursacht wird r ins insulation resistance isolationswiderstand r p parallel resistance parallelwiderstand r r rated resistance nennwiderstand d r r /r r resistance tolerance widerstandstoleranz r s series resistance serienwiderstand r t resistance at temperature t (e.g. r 25 = resistance at 25 c) widerstand bei temperatur t (z.b. r 25 = widerstand bei 25 c) t temperature temperatur d t temperature tolerance temperaturtoleranz t time zeit t a ambient temperature umgebungstemperatur t max upper category temperature obere grenztemperatur (kategorietemperatur) t min lower category temperature untere grenztemperatur (kategorietemperatur) t op operating temperature betriebstemperatur t r rated temperature nenntemperatur t surf surface temperature oberfl?chentemperatur v voltage spannung v ins insulation test voltage isolationsprfspannung v op operating voltage betriebsspannung v test test voltage prfspannung temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 21 of 24 please read cautions and warnings and important notes at the end of this document.
symbol english german a temperature coefficient temperaturkoeffizient d tolerance, change toleranz, ?nderung d th dissipation factor w?rmeleitwert t c thermal cooling time constant thermische abkhlzeitkonstante t a thermal time constant thermische zeitkonstante abbreviations / notes symbol english german surface-mounted devices oberfl?chenmontierbares bauelement * to be replaced by a number in ordering codes, type designations etc. platzhalter fr zahl im bestellnummern- code oder fr die typenbezeichnung. + to be replaced by a letter. platzhalter fr einen buchstaben. all dimensions are given in mm. alle ma?e sind in mm angegeben. the commas used in numerical values denote decimal points. verwendete kommas in zahlenwerten bezeichnen dezimalpunkte. temperature measurement b57551g1 glass-encapsulated sensors with insulation g1551 page 22 of 24 please read cautions and warnings and important notes at the end of this document.
the following applies to all products named in this publication: 1. some parts of this publication contain statements about the suitability of our products for certain areas of application . these statements are based on our knowledge of typical re- quirements that are often placed on our products in the areas of application concerned. we nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application . as a rule, epcos is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. for these reasons, it is always ultimately incum- bent on the customer to check and decide whether an epcos product with the properties de- scribed in the product specification is suitable for use in a particular customer application. 2. we also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified . in customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. the warnings, cautions and product-specific notes must be observed. 4. in order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous) . useful information on this will be found in our ma- terial data sheets on the internet (www.epcos.com/material). should you have any more de- tailed questions, please contact our sales offices. 5. we constantly strive to improve our products. consequently, the products described in this publication may change from time to time . the same is true of the corresponding product specifications. please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. we also reserve the right to discontinue production and delivery of products . consequently, we cannot guarantee that all products named in this publication will always be available. the aforementioned does not apply in the case of individual agreements deviating from the fore- going for customer-specific products. 6. unless otherwise agreed in individual contracts, all orders are subject to the current ver- sion of the "general terms of delivery for products and services in the electrical in- dustry" published by the german electrical and electronics industry association (zvei) . important notes page 23 of 24
7. the trade names epcos, alu-x, ceradiode, ceralink, cerapad, ceraplas, csmp, cssp, ctvs, deltacap, digisimic, dssp, exocore, filtercap, formfit, leaxield, miniblue, minicell, mkd, mkk, motorcap, pcc, phasecap, phasecube, phasemod, phicap, pqsine, siferrit, sifi, sikorel, silvercap, simdad, simic, simid, sineformer, siov, sip5d, sip5k, tfap, thermofuse, windcap are trademarks registered or pending in europe and in other countries. further information will be found on the internet at www.epcos.com/trademarks. important notes page 24 of 24

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